发明名称 METAL BASE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To solve the problem that it is troublesome to assemble a metal base substrate since a printed wiring board is fitted to a metal plate often by soldering and screwing after components are mounted. <P>SOLUTION: The present invention relates to the metal base substrate having the metal plate and printed wiring board, the metal base substrate having the metal plate has at least one fixing pin for fixing the positions of a solder layer formed between the printed wiring board and metal plate and the printed wiring board, and the printed wiring board which has an insertion hole which is formed corresponding to the position of the fixing pin and in which the fixing pin is pressed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009200234(A) 申请公布日期 2009.09.03
申请号 JP20080040040 申请日期 2008.02.21
申请人 NEC CORP 发明人 TAKAHASHI KOICHI
分类号 H05K1/05;H01L23/12;H01L23/36;H05K1/02;H05K3/44 主分类号 H05K1/05
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