| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor wafer by which the yield of productivity is improved and the wafer of high quality is manufactured by making it hard for the sliced wafer to fall from a pedestal and making it easy to peel the wafer from the pedestal and remove an adhesive in a next stage. <P>SOLUTION: The manufacturing method of the semiconductor wafer includes a process of bonding a silicon block 1 to the pedestal 2 with the adhesive 3 and slicing the silicon block bonded to the pedestal into a thin piece by a multi-wire saw device, and a process of peeling the sliced wafer from the pedestal and removing the adhesive sticking on the wafer. In the slicing process, roughness X of a block bonded surface 1a of the silicon block 1 to be bonded to the adhesive 3 and roughness Y of a pedestal bonded surface 2b' of the pedestal 2 to be bonded to the adhesive satisfy a relation of X≤2.5μm<Y≤50μm, and the silicon block 1 is bonded to the pedestal 2 with the adhesive 3 and sliced by the multi-wire saw device. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
