| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To favorably leave desired irregularities on the surface of a wafer while reducing a kerf loss. <P>SOLUTION: This wire saw is provided with: a wire group formed of a cutting wire wrapped around a plurality of guide rollers 26A and driven in the axial direction of the wire; and a work holding member for moving a workpiece in the cut-in direction perpendicular to the wire arrangement direction of the wire group. The wire saw is also provided with: a moving means for moving the wire group and the workpiece relative to each other in the wire arrangement direction; and an NC device 80 for changing and controlling the moving direction. The moving means has: a roller support shaft 40 which supports the guide rollers 26A on the outer periphery and has an internal passage for circulating control water; and a circulation system having a temperature controller 76 for circulating the control water into the internal passage. The NC device 80 changes the temperature of the control water supplied to the roller support shaft 40 at a specified frequency by controlling the temperature controller 76. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
