发明名称 PRINTED CIRCUIT BOARD, METHOD FOR FORMING FRAME GROUND FOR PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
摘要 According to one embodiment, there is provided a printed circuit board, including a frame ground portion in which conductor patterns are formed around a board-fixation hole, and a plurality of through-holes formed around the board-fixation hole in the frame ground portion.
申请公布号 US2009219703(A1) 申请公布日期 2009.09.03
申请号 US20090392789 申请日期 2009.02.25
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 ISHII NORIHIRO;HOSODA KUNIYASU;AINAI SHINYA
分类号 H05K5/00;H05K1/11 主分类号 H05K5/00
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