METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAME
摘要
A method of teaching bonding locations of a semiconductor device on a wire bonding machine is provided. The method includes (1) providing the wire bonding machine with position data for (a) bonding locations of a first component of the semiconductor device, and (b) bonding locations of a second component of the semiconductor device; and (2) teaching the bonding locations of the first component of the semiconductor device and the second component of the semiconductor device using a pattern recognition system of the wire bonding machine to obtain more accurate position data for at least a portion of the bonding locations of the first component and the second component. The teaching step is conducted by teaching the bonding locations in the order in which they are configured to be wire bonded on the wire bonding machine.
申请公布号
WO2009108202(A1)
申请公布日期
2009.09.03
申请号
WO2008US55407
申请日期
2008.02.29
申请人
KULICKE AND SOFFA INDUSTRIES, INC.;COUEY, JEREMIAH;SARBACKER, SHAWN;ODHNER, MATTHEW;DELEY, MICHAEL
发明人
COUEY, JEREMIAH;SARBACKER, SHAWN;ODHNER, MATTHEW;DELEY, MICHAEL