| 摘要 |
Bond strengths between bonded leads of electrical devices and conductive elements of circuit patterns are evaluated by preengaging a flexible member such as a wire or strip of metal with the electrical device prior to the making of the bond to be evaluated. The flexible member is engaged with the electrical device with a predetermined releasability so that, when the flexible member is pulled, the member releases from the device if the bonds are of satisfactory strength but the bonds rupture if they are of unsatisfactory strength and, in this instance, the flexible member remains intact. Particular utility resides in employing this system to evaluate bond strengths of leads of beam-lead integrated circuits or transistors when such devices are bonded to thin-film circuits.
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