发明名称 |
METHOD FOR FORMING SOLDER LUMPS ON PRINTED CIRCUIT BOARD SUBSTRATE |
摘要 |
In this present invention, a method for forming solder lumps on printed circuit board (PCB) substrate is provided. A PCB substrate including a number electrical traces and solder pads formed on a substrate surface thereof is provided. A liquid photoresist is applied onto the PCB substrate such that a photoresist layer defining a number of openings thereof is formed and each of the solder pads is exposed via each of the openings. A solder masses are filled into each of the openings. The solder masses are reflowed and the photoresist layer is removed.
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申请公布号 |
US2009217520(A1) |
申请公布日期 |
2009.09.03 |
申请号 |
US20080266801 |
申请日期 |
2008.11.07 |
申请人 |
FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.;FOXCONN ADVANCED TECHNOLOGY INC. |
发明人 |
HUANG FENG-YAN;LAI YUNG-WEI;LIOU SHING-TZA |
分类号 |
H05K3/10 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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