| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric device, having small oscillation leak at a piezoelectric vibration piece and improved shock resistance performance. SOLUTION: The piezoelectric device comprises a crystal vibration chip 20 having linking terminals 20b and 20c; a package 10 having internal terminals 11b and 11c and holding the crystal vibration chip 20; gold bumps 20d jointed to at least either the linking terminals 20b and 20c or the internal terminals 11b and 11c; and a jointing member 30 for connecting the linking terminals 20b and 20c and the internal terminals 11b and 11c via the gold bump. The device is such that the jointing member 30 is a metal bonding object of a porous structure, where powdered metals have mutually bonded. COPYRIGHT: (C)2009,JPO&INPIT
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