| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device, wherein the productivity is excellent and the shape of the resin that covers each electronic component can be made uniform. <P>SOLUTION: The method for manufacturing the electronic device provided with lead frames for supporting an electronic component 6 surrounded by a casing 8, includes a first resin charging process of charging a resin 10 into each casing 8 on a substrate 5 on which the plurality of supporting lead frames are disposed, and a process of cutting the substrate 5 into individual lead frames. The first resin charging process includes the process of using a mask 1 that has through-holes 1a in positions corresponding to regions surrounded by the casings 8, to charge the resin 10 into the regions surrounded by the casings 8. <P>COPYRIGHT: (C)2009,JPO&INPIT |
