发明名称 PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment device in which the deformation of a member to constitute a gas introduction passage caused by heat generation at the time of plasma generation is prevented, and the uniformity of treatment is maintained. <P>SOLUTION: Gas introduction passages 1b extending in a longitudinal direction are formed between a second face 10b of a first electrode 10 and a side frame 31, and a treatment gas is introduced into a discharge space 1p between the first electrode 10 and a second electrode 20 through the gas introduction passages 1b. Injection ports 25 are formed in the second electrode 20, and the treatment gas plasmolyzed in the discharge space 1p is injected toward an object 9 to be treated. A spacer 40 is interposed in the gas introduction passages 1b. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009199740(A) 申请公布日期 2009.09.03
申请号 JP20080037020 申请日期 2008.02.19
申请人 SEKISUI CHEM CO LTD 发明人 TAKEUCHI HIROTO
分类号 H05H1/24;C23C16/50;H01L21/205;H01L21/3065 主分类号 H05H1/24
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