发明名称 VISUAL EXAMINATION METHOD OF ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a visual examination method of an electronic component capable of inspecting the joined state of a shielding lid member and a circuit mounted base in the electronic component provided with the shielding lid member. <P>SOLUTION: In the visual examination method of the electronic component composed of the component mounted base 2 and the metal lid member 3 which covers at least one side of the base 2 and is joined and held to the electrode 4 provided to the base 2 through solder 5, halation is produced by throwing light with a definite luminous intensity on the connection part 6 of the lid member 3 and the base 2 from its back to more darkly express the recessed part 20 between the lid member 3 and the base 2 than another part to detect a defective place. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009198182(A) 申请公布日期 2009.09.03
申请号 JP20080036825 申请日期 2008.02.19
申请人 PANASONIC CORP 发明人 FURUTA YOSHINOBU;NISHINO NAGAKANE;OKAMOTO TAKAO
分类号 G01N21/956;G01B11/24;G01N21/84;H05K13/08 主分类号 G01N21/956
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