发明名称 |
SOLID-STATE IMAGE PICKUP DEVICE |
摘要 |
<p>A solid-state image pickup device (1) comprises: an image sensor wafer (2A) including image sensors (3); an optically-transparent protection member (4) connected by use of an adhesive agent (7) via a spacer (5) arranged to surround the image sensors (3); and an electrostatic (ESD) protection circuit (10) disposed on the image sensor wafer (2A) so as to avoid a position corresponding to a connected surface where the spacer (5) and the image sensor wafer (2A) are connected. Accordingly, in this configuration, even when polarization occurs in the adhesive agent, since the p-well layer between diffusion layers of the ESD protection circuit is not disposed immediately below the connected surface, the p-well layer is not inverted by electric charges in the element interface and thus parasitic MOS transistor does not turn on, allowing suppression of leak current.</p> |
申请公布号 |
EP2095422(A1) |
申请公布日期 |
2009.09.02 |
申请号 |
EP20070850671 |
申请日期 |
2007.12.10 |
申请人 |
FUJIFILM CORPORATION;FUJIFILM PHOTONIX CO., LTD. |
发明人 |
TAKASAKI, KOSUKE;IESAKA, MAMORU;WAKO, HIDEKI |
分类号 |
H01L27/146;H01L27/14;H04N5/335 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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