THE FOR WIRE BONDINGEQUIPMENT FOR SEMICONDUCTOR PACKAGES

摘要

A gripper of a wire bonding apparatus is provided to reduce an error of the device when gripping a substrate and transferring it by making a lower and upper tong bite the substrate at the same time. In a gripper of a wire bonding apparatus, a gripper(5) is rotated with being link with a driving motor. A rotary shaft(2) comprises a thread of other directions on the top and outer circumference of the lower part, and a lower tong(3) forms a first thread hole corresponding to a screw thread is formed in the lower part of the rotary shaft. A lower tong has a lower gripper(32) which is adhered to closely the bottom of the substrate. An upper tong(4) forms a second thread hole(41) corresponding to a screw thread on the rotary shaft.