| 摘要 |
<p>The chip card comprises a card body comprising first (11), second (12) and third (13) layers, a semiconductor chip completely covered by the card body, and an antenna arranged in the map body. The third layer is arranged between the first and the second layers, consists of a material with a melting point of less than 150[deg] C and comprises a thickness of 3-10 mu m. The semiconductor chip is a part of a semiconductor module, which comprises a carrier and a housing for the semiconductor chip and has rounded edges with an edge radius of >= 0.1 mm. The chip card comprises a card body comprising first (11), second (12) and third (13) layers, a semiconductor chip completely covered by the card body, and an antenna arranged in the map body. The third layer is arranged between the first and the second layers, consists of a material with a melting point of less than 150[deg] C and comprises a thickness of 3-10 mu m. The semiconductor chip is a part of a semiconductor module, which comprises a carrier and a housing for the semiconductor chip and has rounded edges with an edge radius of >= 0.1 mm. The first or second layer is optically transparent. The third layer is a carrier for optical or electronic security features and is optically transparent in sub-areas. An independent claim is included for a method for manufacturing a card body for a smart card.</p> |
