| 摘要 |
A printed circuit board and a flip chip package are provided to prevent a fault due to the flux remaining on the pad by forming a non-wetting film in a space between pads. A flip chip package includes a printed circuit board(220), a semiconductor chip(212), and a sealant(214). A printed circuit board includes an insulating layer(202), a plurality of pads(204), a non-wetting film(206), and a solder resist(208). The plurality of pads are formed on the insulating layer. The non-wetting film is formed on the insulating layer and the space between pads. The solder resist is coated on the non-wetting film in order to expose a part of the non-wetting film and the pads. The semiconductor chip is flip-chip bonded on the printed circuit board. The sealant seals one side of the printed circuit board including the semiconductor chip.
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