METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS MADE WITH AN LCP SUBSTRATE,申请号EP20050781615-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	METHOD AND APPARATUS FOR SEALING FLEX CIRCUITS MADE WITH AN LCP SUBSTRATE
摘要
申请公布号	EP1789840(A4)	申请公布日期	2009.09.02
申请号	EP20050781615	申请日期	2005.08.01
申请人		发明人
分类号	G02F1/1339	主分类号	G02F1/1339
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Electric switch

Modified starch composition for removing solid particles from aqueous dispersions

Fluidised bed reactor

Cis-platinum containing granules

Electroplating method of depositing protective layers for use in mapping an intended microtopography of surface of articles made of amorphous materials in particular of ceramic and glass ones

Underground mining method useful in getting solid mineral deposits

Method of utilising pollutants removed from coke-oven gas

Dowel seating device

Method of obtaining base oils of increased quality

Method of obtaining hydrocarbonaceous resins

Electric wiring connector

Method of obtaining derivatives of isothiazolocarboxylic acid exhibiting immunosuppressive properties

Method of obtaining acrylic and/or methacrylic multiesters

Novel 1 α-hydroxy-5-androsten-7,17-dione and method of obtaining same

Device for producing embossed dots in particular for use in Braille-system recording

MULTIVALENT MENINGOCOCCAL POLYSACCHARIDE-PROTEIN CONJUGATE VACCINE

METHOD OF REALIZATION ANTICORROSION COAT ON THE SHIELD WARM OF FURNACE CHAMBER

MDF PRESS TECHNOLOGY

RELEASABLE COUPLING ASSEMBLY