| 摘要 |
PROBLEM TO BE SOLVED: To overcome the problem wherein soldered sections on a substrate are large in number, and a production tact is drastically increased if a height measurement is implemented for all soldered sections although a defect of a solder excess can be inspected by the height measurement in the soldered section since it is determined by the solder quantity as the quality. SOLUTION: A soldering inspection method of the invention for overcoming the problem detects the solder excess in the state where the solder quantity is increased in the perpendicular direction perpendicular to the surface of the substrate, and has: an imaging process for imaging the solder on the substrate in the perpendicular direction; a candidate extraction process for extracting a solder excess candidate based on an image captured by the imaging process; a height measurement process for measuring a height of the solder excess candidate extracted in the candidate extraction process in the perpendicular direction; and a detection process for detecting the solder excess based on the height measured in the height measurement process. COPYRIGHT: (C)2011,JPO&INPIT
|
