SYSTEM SUPPORT FOR ELECTRONIC COMPONENTS AND METHOD FOR PRODUCTION THEREOF

摘要

A chip (2, 3) is arranged above a top side of a flexible support (1) and mechanically decoupled from the support. Electrical connections (8, 11) of the chip are embodied using a planar connection technique. The chip can be separated from the support by an air gap or a base layer (7) composed of a soft or compressible material.