INTEGRATED CIRCUIT PACKAGE WITH MULTIPLE DIES AND A MULTIPLEXED COMMUNICATIONS INTERFACE

摘要

A package includes a first die and a second die, at least one of said first and second dies being a memory. The dies are connected to each other through an interface. The interface is configured to transport both control signals and memory transactions. A multiplexer is provided to multiplex the control signals and memory transactions onto the interface such that a plurality of connections of said interface are shared by the control signals and the memory transactions.