| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compact power conversion apparatus ensuring superior heat dissipation by suppressing deformation of an electronic circuit board. <P>SOLUTION: The power conversion apparatus 1 includes a first electronic circuit board 21 and a second electronic circuit board 22 laminated in the thickness direction while being spaced apart from each other, a plurality of semiconductor modules 3 disposed on the surface opposite to the second electronic circuit board 22 in the first electronic circuit board 21 and equipped with signal terminals 31 connected to the first electronic circuit board 21, fixing members 4 fixing the first electronic circuit board 21 and the second electronic circuit board 22 to each other, and spacers 5 each of which is installed between the first electronic circuit board 21 and the second electronic circuit board 22 with space between both. The spacers 5 are arranged and installed at arrangement regions of the plurality of semiconductor modules 3 when viewed from a laminated direction of the first electronic circuit board 21 and the second electronic circuit board 22. <P>COPYRIGHT: (C)2011,JPO&INPIT |
