| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cutting device capable of preventing defects such as the elongation and the chipping of an electrodes, and the generation of cracks , and to provide a cutting method thereof. <P>SOLUTION: Provided is the cutting device comprising a holding table 30 that holds a package substrate and a cutting means including a cutting blade that cuts the package substrate. The holding table 30 is composed of a holding surface that holds the package substrate, a holding jig 28 having a plurality of undercuts 40 for cutting blades formed in the corresponding positions on the dividing schedule line of the package substrate, and a plurality of suction holes 42 formed in each region divided by the undercut 40 for cutting blades, a negative pressure transmission unit that transmits negative pressure to the sucking hole 42, and a jig base 22 having a mounting surface to which the holding jig 28 is mounted. The holding jig 28 includes a fluid injection hole 44 that is formed at the undercut 40 for cutting blades while the jig base 22 includes a fluid supply passage 26 that is connected to the fluid injection hole 44 and a fluid supply source 58. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
