发明名称 THERMAL HEAD CONTROL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a thermal head control device for controlling boring diameters by driving and controlling a thermal head based on multivalue data, by which miss or fluctuation of boring is suppressed. SOLUTION: The thermal head control device controls boring such that the heating time of a heating element applying small boring smaller than large boring is longer than the heating time of a heating element applying the large boring to stancil plate base paper, and controls boring such that the temperature of the heating element applying the small boring is lower than the temperature of the heating element applying the large boring. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011110729(A) 申请公布日期 2011.06.09
申请号 JP20090266928 申请日期 2009.11.25
申请人 RISO KAGAKU CORP 发明人 HORIKAWA NAOYUKI
分类号 B41C1/055;B41J2/32;B41J2/36 主分类号 B41C1/055
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