| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can surely form a wiring pattern in prescribed width and firmly adhere a wiring pattern and an insulating layer each other. SOLUTION: The method comprises a step for forming a first metal layer 2 on an insulating layer 1; a step for partially forming a resist 3 on the first metal layer 2; a step for replacing a part of the first metal layer 2 which is not covered with the resist 3, with a second metal layer 4; a step for forming a third metal layer 5 on the second metal layer 4 so as to be lower than or equal to that of the resist 3; a step for removing the resist 3; and a step for etching and removing the first metal layer 2 with a etching solution which does not etch the second metal layer 4 and the third metal layer 5. COPYRIGHT: (C)2011,JPO&INPIT
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