| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board with a wiring conductor of low resistance and a terminal for probe of small variations in height. SOLUTION: The wiring conductor 2 and the terminal 3 for probe in contact with the wiring conductor 2 are formed on the top surface of an insulating substrate 1, in the wiring board. The wiring conductor 2 includes a thin film conductor layer 2a, an electrolytic plating layer 2b and a surface plating layer 2c stuck in this order from the top surface of the insulating substrate 1, and the terminal 3 for probe includes a thin film conductor layer 3a and a surface plating layer 3b stuck in this order from the top surface of the insulating substrate 1, in the wiring board. Even when the wiring board is large, the terminal 3 for probe is not affected by variations in a height of the electrolytic plating layer 2b, thereby variations in a height of the terminal 3 for probe can be suppressed. Further, resistance of the wiring conductor 2 is made low by thickening the electrolytic plating layer 2b. COPYRIGHT: (C)2011,JPO&INPIT
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