发明名称 |
Apparatus for manufacturing printed circuit board |
摘要 |
Disclosed is an apparatus for manufacturing a printed circuit board. The apparatus for manufacturing the printed circuit board includes: a supplier for supplying a substrate of a sheet type; a first printer for printing paste on the substrate supplied from the supplier to thereby form preliminary bumps; a provisional dryer which is arranged on one side of the first printer and provisional-dries the preliminary bumps; a second printer which is arranged on one side of the provisional dryer to be in series to the first printer and prints paste on the preliminary bumps; a dryer which is arranged on one side of the second printer and dries and cures the preliminary bumps to thereby form bumps; and a penetrator which is arranged on one side of the dryer, and allows the bump to pass through prepreg and bonds the prepreg and the substrate together.
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申请公布号 |
US2011132546(A1) |
申请公布日期 |
2011.06.09 |
申请号 |
US20100659029 |
申请日期 |
2010.02.23 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
OH YOONG;YANG DEK GIN |
分类号 |
B32B38/14;B32B37/02;B32B38/04 |
主分类号 |
B32B38/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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