发明名称 Apparatus for manufacturing printed circuit board
摘要 Disclosed is an apparatus for manufacturing a printed circuit board. The apparatus for manufacturing the printed circuit board includes: a supplier for supplying a substrate of a sheet type; a first printer for printing paste on the substrate supplied from the supplier to thereby form preliminary bumps; a provisional dryer which is arranged on one side of the first printer and provisional-dries the preliminary bumps; a second printer which is arranged on one side of the provisional dryer to be in series to the first printer and prints paste on the preliminary bumps; a dryer which is arranged on one side of the second printer and dries and cures the preliminary bumps to thereby form bumps; and a penetrator which is arranged on one side of the dryer, and allows the bump to pass through prepreg and bonds the prepreg and the substrate together.
申请公布号 US2011132546(A1) 申请公布日期 2011.06.09
申请号 US20100659029 申请日期 2010.02.23
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 OH YOONG;YANG DEK GIN
分类号 B32B38/14;B32B37/02;B32B38/04 主分类号 B32B38/14
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