Anordnung mit einem Leistungshalbleiterbauelement und mit einem Gehäuse sowie Herstellungsverfahren hierzu

摘要

The module has a power semiconductor component (70) and an electrically insulating housing, where the component is arranged in a substrate with its main surface. The component has a contact surface with a metallization layer from precious metal e.g. gold, on another main surface that is turned away from the substrate. The contact surface and a metal mould body (76) are connected with one another by a power sintering connection, where the body has a precious metal layer on the former main layer facing the component. An independent claim is also included for a method for manufacturing an arrangement.