| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition containing a new thermally cross-linkable compound and useful as an electrically insulating material for electronic parts and display elements. <P>SOLUTION: There are provided the thermally cross-linkable compound represented by general formula (1) (wherein, R groups are each independently a 1 to 4C monovalent aliphatic hydrocarbon group), and the photosensitive resin composition containing the compound. The resin composition prepared by using the thermally cross-linkable compound, a polyimide precursor resin, and a polybenzoxazole precursor resin has good viscosity stability, when stored at room temperature, and is thermally cured to form a thermally cured film having low hygroscopicity. <P>COPYRIGHT: (C)2011,JPO&INPIT |
