发明名称 WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board which meets a requirement for enhancing electric reliability. <P>SOLUTION: The wiring board includes a plurality of inorganic insulating layers 5, a plurality of resin layers 6 interposed between the inorganic insulating layers 5, and a plurality of conductive layers 7 separated in a thickness direction through the inorganic insulating layers 5 and the resin layers 6. The plurality of resin layers 6 have a first resin layer 6a located on an uppermost layer of the resin layers 6, and the first resin layer 6a is smaller in a thickness than the other resin layers 6. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011114121(A) 申请公布日期 2011.06.09
申请号 JP20090268495 申请日期 2009.11.26
申请人 KYOCERA CORP 发明人 HAYASHI KATSURA
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
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