SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same that suppress characteristic variation and characteristic variance of a semiconductor element and a semiconductor IC caused by moisture absorption and drying of a mold material. SOLUTION: The present invention relates to the semiconductor device 1 and the method of manufacturing the same that specify a material which cancels stress of the mold material 103 as a material of a protective film 101 covering at least a part of the semiconductor element 104 resin-sealed with the mold material 103. COPYRIGHT: (C)2011,JPO&INPIT