INSULATING RESIN, COMPOSITION FOR FORMING INSULATING RESIN LAYER, LAMINATE, METHOD FOR PRODUCING SURFACE METAL FILM MATERIAL, METHOD FOR PRODUCING METAL PATTERN MATERIAL, METHOD FOR PRODUCING WIRING BOARD, ELECTRONIC PART AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an insulating resin with excellent adsorptive properties to a plating catalyst or a precursor thereof and resistance to hydrolysis; an insulating resin layer-forming composition; a laminate easily forming a metal film or a metal pattern with excellent close adhesion to a substrate; and methods for producing a surface metal film material and a metal pattern material. SOLUTION: The insulating resin includes a copolymer including units represented by formulae, wherein the content rate of the unit represented by (C) is less than 20 mol% of the total units included in the copolymer. In formulae (A) to (C), R1to R6are each independently a hydrogen atom or a substituted or unsubstituted alkyl group; Y, Z and U are each independently a single bond, a substituted or unsubstituted bivalent hydrocarbon group, an ester group, an amide group, or an ether group; L1and L2are each independently a single bond or a substituted or unsubstituted bivalent linking group; and V is an ionic polar group. COPYRIGHT: (C)2011,JPO&INPIT