INSULATING RESIN, INSULATING RESIN LAYER-FORMING COMPOSITION, LAMINATE, METHOD FOR MANUFACTURING SURFACE METAL FILM MATERIAL, METHOD FOR MANUFACTURING METAL PATTERN MATERIAL, METHOD FOR MANUFACTURING WIRING BOARD, ELECTRONIC PART, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an insulating resin with excellent adsorptive properties to a plating catalyst or a precursor thereof and forming an insulating resin layer with excellent resistance to a plating solution; an insulating resin layer-forming composition comprising the insulating resin; a laminate easily forming a metal pattern; a method for manufacturing a surface metal film material using the laminate; and a method for manufacturing a metal pattern material. SOLUTION: The insulating resin includes a copolymer represented by formula (A), formula (B), and formula (C), wherein, R1to R6are each hydrogen or an alkyl group; Z and V are each a bivalent hydrocarbon group or the like; W and W1are each a nondissociative functional group forming interaction with a plating catalyst or a precursor thereof; and R7and R8are each alkyl, alkenyl, alkynyl, aryl, -L2-W1or the like. COPYRIGHT: (C)2011,JPO&INPIT