摘要 |
<p>A solid state diffusion bonding process of joining metal parts abutted between a support and a totatable electrode comprises applying localised pressure (500-10,000 psi) and electric resistance heating via the electrode while simultaneously moving the parts relative to the electrode. The current to the parts is controlled to maintain the temp. below the melting pt. The parts may be the same or different e.g. superalloys T, Ni, Be and their alloys and the electrode may be Mo or Mo based alloy. More than one electrode is used and the assembly held in a jig.</p> |