| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting element package and a method of manufacturing the same. <P>SOLUTION: The light emitting diode package includes: an LED chip; a body part having the LED chip mounted thereon; a pair of reflective parts extending from the body part to face each other while interposing the LED chip therebetween, and reflecting light emitted from the LED chip; and a molding part provided between the pair of reflective parts to encapsulate the LED chip and having a top surface whose central region is curved inwards. <P>COPYRIGHT: (C)2011,JPO&INPIT |
