发明名称 SOLDER COAT FILM FORMING METHOD AND DEVICE THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a device that solves a problem of overvolume of a very narrow pitch part etc., and further reduces economical inefficiency accompanying frequent disposal of deteriorated solder by preventing impurities such as flux and copper oxide from being mixed and accumulated over time in a molten solder liquid circulating jet type automatic soldering device and method. SOLUTION: After a solder coat is formed on an electrode pad or a lead surface of an electronic component 5 by jetting an organic fatty acid solution 8 and molten solder 1 from nozzles 4 and 14, the organic fatty acid solution and molten solder which overflow are sent to a stirrer 9 to strongly stir and mix them in the stirrer, the copper oxide, flux components and reaction products thereof, oxidation impurities, etc., mixed in the overflowing solution are taken into the organic fatty acid solution, and the molten solder is purified and reused to prevent copper from being accumulated in the molten solder liquid, thereby continuously performing stable soldering for a long period. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011114334(A) 申请公布日期 2011.06.09
申请号 JP20090284506 申请日期 2009.11.26
申请人 HORIZON GIJUTSU KENKYUSHO KK 发明人 ISHIKAWA HISAO;KIMURA MITSUYOSHI;YOKOYAMA MASANORI
分类号 H05K3/34;B23K1/00;B23K1/20;B23K35/26;B23K35/363;B23K101/40;B23K101/42;C22C13/00 主分类号 H05K3/34
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