| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for drying rapidly a semiconductor wafer in a resting state in a drying apparatus without using a spin dryer and without particles adhesion on the surface of the semiconductor wafer and a water mark generation on the semiconductor wafer and a holding cassette. SOLUTION: This method repeats processes of: introducing a semiconductor wafer after washing which is held in each holding chamber of a cassette into a drying apparatus 1 and fixing the cassette in which a semiconductor wafer is held in a drying chamber 1c in the drying apparatus 1; compellingly jetting a radial hot wind through a jetting nozzle provided in an upper part of the drying chamber 1c; evaporation drying residual water content adhering to the semiconductor wafer and the holding cassette in the chamber by vacuum drying at a certain temperature for a short period after the stop of warm wind jetting; putting the semiconductor wafer and the holding cassette again under an atmospheric pressure and compellingly jetting again the radial hot wind to the semiconductor wafer and the holding cassette through the jetting nozzle; and vacuum drying again the semiconductor wafer and the holding cassette at a certain temperature. COPYRIGHT: (C)2011,JPO&INPIT
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