POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE CURED FILM

摘要

A positive-type photosensitive resin composition includes (A) an alkali-soluble resin, (B) a photosensitizer, and (C) a silicon compound shown by the following general formula (1). (R2O)3—Si—R1—Si—(OR2)3  (1) wherein R1 represents an alkylene group having 5 to 30 carbon atoms or an organic group that includes at least one aromatic ring, and R2 represents an alkyl group having 1 to 10 carbon atoms. The positive-type photosensitive resin composition exhibits excellent storage stability, produces a film that exhibits excellent adhesion to a substrate during development, and produces a cured film that exhibits excellent adhesion to a substrate after humidification.