SEMICONDUCTOR INTEGRATED CIRCUIT AND SEMICONDUCTOR DEVICE PROVIDED WITH THE SAME, AND ELECTRONIC EQUIPMENT

摘要

Disclosed is a semiconductor integrated circuit provided with: a sealing ring formed on a semiconductor chip at the outer periphery of the semiconductor chip; a pad formed on the semiconductor chip nearer the center of the semiconductor chip than the sealing ring; wiring formed on the semiconductor chip, between the sealing ring and the pad; a pattern formed on the semiconductor chip, between the sealing ring and the wiring, and also formed between the wiring and the pad; a first protective film formed so as to cover the area from part of the sealing ring to part of the pad; and a second protective film formed so as to cover part of the first protective film and the pad.