发明名称 |
BALL GRID ARRAY BGA CONNECTION SYSTEM AND RELATED METHOD AND BALL SOCKET |
摘要 |
<p>A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.</p> |
申请公布号 |
KR101040506(B1) |
申请公布日期 |
2011.06.09 |
申请号 |
KR20097002420 |
申请日期 |
2007.07.03 |
申请人 |
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发明人 |
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分类号 |
H01R33/76;H01L21/60;H01L23/12;H05K3/34 |
主分类号 |
H01R33/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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