| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent disadvantages to capacitor characteristics and reliability that may be caused by the formation of fine unevenness to increase adhesion strength when using an interconnection layer of a laminated wiring board as a capacitor bottom electrode. <P>SOLUTION: On the surface of the interconnection layer 14 in a laminated board structure, fine unevenness is formed to obtain the adhesion strength when pasting the other insulation substrate 19a to an insulation substrate 10. On the interconnection layer 14 having the fine unevenness, a conductive layer 16 is formed. With the conductive layer 16 as a bottom electrode, a capacitive element composed of a capacitor dielectric film 17 and a top electrode 18 that are laminated on each other is formed on the bottom electrode. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
