发明名称 CONTACTING POINT CONTACT PRESSURE ADJUSTING METHOD OF ELECTROMAGNETIC RELAY
摘要 PROBLEM TO BE SOLVED: To aim at downsizing of an electromagnetic relay capable of adjusting contacting point contact pressure. SOLUTION: A core 3 is inserted into a bobbin 1a up to a temporary fixed position, then the core 3 is moved to the bobbin 1a up to a position where a movable contact 7 and a fixed contact 8 are in contact with each other in a state in which a thickness gage 10 provided in a predetermined thickness is arranged between the core 3 and an armature 5 to be conducted to a coil 2 (a state in Fig.4). According to this, as the coil 2 is energized with the thickness gage 10 in a removed state, in a process of the armature 5 moving toward a core 3 side, a spring 6 is bent after the time of contacting of the movable contact 7 and a fixed point. Since an amount of bending volume of the spring 6 is proportional to a thickness of the thickness gage 10, an amount of bending volume of the spring 6 is adjusted by the thickness of the thickness gage 10, and as a result, a contact pressure between the movable contact 7 and the fixed contact 8 can be adjusted. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011113780(A) 申请公布日期 2011.06.09
申请号 JP20090268349 申请日期 2009.11.26
申请人 ANDEN 发明人 IZUMI SEISHI;KURITA SHINGO
分类号 H01H49/00;H01H50/00;H01H50/54 主分类号 H01H49/00
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