CONDUCTIVE PASTE, PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a conductive paste capable of enhancing an inter-layer connection reliability, a printed circuit board using the same, and a method of manufacturing the same. SOLUTION: A conductive paste is filled in a through-via or a bottomed via arranged on a prepreg and inter-layer connection is carried out by heating pressure. As a binder resin contained in the conductive paste, either of epoxidized vegetable oil, an esterified vegetable oil, or wax is used. Thereby, a conductive metal material in the conductive paste can be diffused sufficiently to enhance an inter-layer connection reliability. COPYRIGHT: (C)2011,JPO&INPIT