发明名称 METHOD OF FORMING AT LEAST ONE BONDING STRUCTURE
摘要 A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary compressed ball on a first pad using the ball. The capillary may be moved upwardly to form a neck portion on the preliminary compressed ball using the preliminary compressed ball and the wire. The capillary may be moved obliquely and downwardly to form a compressed ball. The capillary may extend the wire from the compressed ball to a second pad.
申请公布号 US2011136334(A1) 申请公布日期 2011.06.09
申请号 US20100903714 申请日期 2010.10.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 RYU HWANG-BOK;JUNG KY-HYUN;PARK JAE-YONG;SONG HO-GEON
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址