发明名称 |
METHOD OF FORMING AT LEAST ONE BONDING STRUCTURE |
摘要 |
A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary compressed ball on a first pad using the ball. The capillary may be moved upwardly to form a neck portion on the preliminary compressed ball using the preliminary compressed ball and the wire. The capillary may be moved obliquely and downwardly to form a compressed ball. The capillary may extend the wire from the compressed ball to a second pad.
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申请公布号 |
US2011136334(A1) |
申请公布日期 |
2011.06.09 |
申请号 |
US20100903714 |
申请日期 |
2010.10.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
RYU HWANG-BOK;JUNG KY-HYUN;PARK JAE-YONG;SONG HO-GEON |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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