发明名称 SCHOTTKY BARRIER DIODE AND METHOD FOR MANUFACTURING SCHOTTKY BARRIER DIODE
摘要 A method for manufacturing a Schottky barrier diode includes the following steps. First, a GaN substrate is prepared. A GaN layer is formed on the GaN substrate. A Schottky electrode including a first layer made of Ni or Ni alloy and in contact with the GaN layer is formed. The step of forming the Schottky electrode includes a step of forming a metal layer to serve as the Schottky electrode and a step of heat treating the metal layer. A region of the GaN layer in contact with the Schottky electrode has a dislocation density of 1×108 cm−2 or less.
申请公布号 US2011133210(A1) 申请公布日期 2011.06.09
申请号 US200913057241 申请日期 2009.07.23
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 HORII TAKU;MIYAZAKI TOMIHITO;KIYAMA MAKOTO
分类号 H01L29/20;H01L21/283 主分类号 H01L29/20
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