SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

摘要

PURPOSE: A semiconductor device and manufacturing method thereof are provided to fill a dielectric insulating material in a groove between an area where an electronic circuit is formed and a scribe area, thereby preventing moisture from being inserted into the area where the electronic circuit is formed. CONSTITUTION: A multilayer wiring layer is installed on the main surface of a semiconductor substrate. A first organic insulating material layer(6a) is installed on the multilayer wiring layer. A groove penetrates the multilayer wiring layer on a scribe area surrounding a semiconductor device. A wiring layer is installed on a first organic insulating material layer. A second organic insulating material layer(6b) covers the wiring layer.