发明名称 CUTTER AND CUTTING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To suppress displacement of a position of a mother laminate when removing a peripheral area from the mother laminate. <P>SOLUTION: The mother laminate 50 having a laminate area 50a including a plurality of laminates arranged in a matrix shape and the peripheral area 50b provided around the laminate area 50a is placed on a table 22. A cutting blade 21 and a cutting driving part 8 cut and separate the peripheral area 50b from the laminate area 50a. A suction part 23 and a suction driving part 12 remove the peripheral area 50b from the table 22. A fixing part 24 and a fixing driving part 13 fix the laminate area 50a to the table 22 when the peripheral area 50b is removed by the suction part 23 and the suction driving part 12. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011110714(A) 申请公布日期 2011.06.09
申请号 JP20090266202 申请日期 2009.11.24
申请人 MURATA MFG CO LTD 发明人 MASUI YOSHINORI
分类号 B32B37/00;B26D3/00;H01F41/04;H01G4/12;H01G4/30;H01G13/00 主分类号 B32B37/00
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