| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To realize a one-pack epoxy resin composition for which a variety of types of curing agents can be used and which is suppressed in the occurrence of separation between an epoxy resin and a curing agent even when used in a gap of about several tens of micrometers. <P>SOLUTION: The epoxy resin composition of this invention relates to a one-pack epoxy resin composition for hermetically sealing electronic components or electrical components and comprises a liquid epoxy resin, dicyandiamide, and a filler, wherein the average particle diameter of the filler is in the range of 0.1-1μm, the proportion of particles of particle diameters of 5μm or larger to the entire filler is 20 wt.% or smaller, and the content of the filler is in the range of 5-60 pts.wt. based on 100 pts.wt. the epoxy resin. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
