发明名称 |
Reducing Plating Stub Reflections in a Chip Package Using Resistive Coupling |
摘要 |
Improving signal quality in a high-frequency chip package by resistively connecting an open-ended plating stub to ground. One embodiment provides a multi-layer substrate for interfacing a chip with a printed circuit board. A conductive first layer provides a chip mounting location. A signal interconnect is spaced from the chip mounting location, and a signal trace extends from near the chip mounting location to the signal interconnect. A chip mounted at the chip mounting location may be connected to the signal trace by wirebonding. A plating stub extends from the signal interconnect, such as to a periphery of the substrate. A resistor is used to resistively couple the plating stub to a ground layer.
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申请公布号 |
US2011133326(A1) |
申请公布日期 |
2011.06.09 |
申请号 |
US20090630720 |
申请日期 |
2009.12.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CASES MOISES;MUTNURY BHYRAV M.;NA NANJU |
分类号 |
H01L23/498;C23C14/34;H05K1/03;H05K3/20 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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