发明名称 |
Package substrate and method of fabricating the same |
摘要 |
There is provided a package substrate allowing for enhanced reliability by improving the structure of a solder bump and a method of fabricating the same. The package substrate includes: a substrate having at least one conductive pad; an insulating layer provided on the substrate and having an opening to expose the conductive pad; a post terminal provided on the conductive pad inside the opening; and a solder bump provided on the post terminal and having an angle between a bottom surface and a side surface thereof ranging from 80° to 120°.
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申请公布号 |
US2011133332(A1) |
申请公布日期 |
2011.06.09 |
申请号 |
US20100926279 |
申请日期 |
2010.11.05 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MUN SEON JAE;LEE DAE YOUNG;CHUNG TAE JOON;LEE DONG GYU;CHOI JIN WON |
分类号 |
H01L23/498;H01L21/60 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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