METHOD OF FORMING DEVICES HAVING PLASTIC SUBSTRATES
摘要
Provided is a method of forming a device having a plastic substrate. The method forming the plastic substrate, thermally processing the plastic substrate, and applying the thermally treated plastic substrate to the device.
申请公布号
US2011132517(A1)
申请公布日期
2011.06.09
申请号
US20100764778
申请日期
2010.04.21
申请人
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE