| 摘要 |
Provided is an LED-equipped illumination apparatus which will not bend downwards from the weight of LED substrates. The illumination apparatus is equipped with a substrate (4) upon which a plurality of LED chips (7), which are semiconductor light emitting elements, are installed; and a body cover (1) which covers the substrate (4), the body cover (1) of the illumination apparatus formed such that the central portion thereof is warped 3 mm in the ceiling direction. |
